QPICPAC - Chip Packaging Solution

Wave Photonics provides an easy-to-use turnkey packaging solution for prototyping and R&D.

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QPICPAC - Chip Packaging Solution

As part of an Innovate UK project, QPICPAC, we have worked together with SENKO Advanced Components, a company producing high quality optical components, and Alter Technology, who offer advanced packaging solutions, to create an easy-to-use reusable packaging solution. Our packaging solution provides a template-driven approach to minimise custom development requirements and costs. For more information, please sign up to our platform or contact us at pdk@wavephotonics.com.

Package your chips using our solution

1

Design your chip using the QPICPAC template

Design

2

With information such as the number of chips and fabrication run

Contact us

3

Ensure design is suitable for packaging

Screening

4

All consumables ordered now to avoid delays

Tapeout & payment

5

Chips go directly from foundry to Alter for packaging

Chips ready

6

Receive your packaged chips

Packaged chips