QPICPAC - Chip Packaging Solution
Wave Photonics provides an easy-to-use turnkey packaging solution for prototyping and R&D.
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QPICPAC - Chip Packaging Solution
As part of an Innovate UK project, QPICPAC, we have worked together with SENKO Advanced Components, a company producing high quality optical components, and Alter Technology, who offer advanced packaging solutions, to create an easy-to-use reusable packaging solution. Our packaging solution provides a template-driven approach to minimise custom development requirements and costs. For more information, please sign up to our platform or contact us at pdk@wavephotonics.com.
Package your chips using our solution
1
Design your chip using the QPICPAC template
Design
2
With information such as the number of chips and fabrication run
Contact us
3
Ensure design is suitable for packaging
Screening
4
All consumables ordered now to avoid delays
Tapeout & payment
5
Chips go directly from foundry to Alter for packaging
Chips ready
6
Receive your packaged chips
Packaged chips