Chip Packaging Solutions
Wave Photonics provides easy-to-use turnkey packaging solutions for prototyping and R&D.
QPICPAC - Chip Packaging Solution
As part of an Innovate UK project, QPICPAC, we have worked together with SENKO Advanced Components, a company producing high quality optical components, and Alter Technology, who offer advanced packaging solutions, to create an easy-to-use reusable packaging solution. Our packaging solution provides a template-driven approach to minimise custom development requirements and costs. For more information, please sign up to our platform or contact us at pdk@wavephotonics.com.
Learn More about the QPICPAC packaging service
PHIX Characterization Package Template
Wave Photonics provides easy-to-use photonic chip packaging templates for the PHIX Characterization Package solution. These templates are available for both the CORNERSTONE SOI 220 nm passive and active fabrication processes.
We have packaging templates available for Wave Photonics’ PDK of optimised components as well as CORNERSTONE open-source PDKs.
For more information, please sign up to our platform or contact us at pdk@wavephotonics.com.
PDK Packaging templates
Wave Photonics PDK Packaging Templates
Packing Templates have been designed for Wave Photonics' PDK for the CORNERSTONE SOI 220 nm fabrication processes. These templates use Wave Photonics' components optimised for the PHIX fibre arrays, which can improve coupling performance and reduce coupling loss.
CORNERSTONE PDK Packaging Templates
Wave Photonics also offers free-to-use packaging templates for the open-source, license-free PDKs provided by CORNERSTONE foundry for CORNERSTONE’s SOI 220 nm fabrication processes. These templates use the open-source CORNERSTONE PDK which was not designed for PHIX fibres and may result in poor coupling.
Package your chips with our packaging templates
1
Design your chip using our packaging template.
Design
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With information such as the number of chips and fabrication run.
Contact us
3
We ensure the design is suitable for packaging.
Screening
4
All consumables ordered now to avoid delays.
Tapeout & payment
5
Chips go directly to packaging company for packaging.
Chips ready
6
Receive your packaged chips.
Packaged chips