Wave Photonics launches QPICPAC Chip Packaging Solution for prototyping and R&D

Wave Photonics has launched an easy-to-use turnkey packaging solution for prototyping and R&D.

Wave Photonics, SENKO Advanced Components, a company producing high-quality optical components, and Alter Technology, who offer advanced packaging solutions, have worked together as part of an Innovate UK project referred to as Quantum Photonic Integrated Circuit PACkaging (QPICPAC), to produce packaging solutions for Quantum Photonic Integrated Circuits (QPICs).

The packaging solution, which includes design templates and components, can minimise custom development requirements and costs for quantum technology companies.

Find out more here.