Process Design Kits (PDKs)

Access component designs and the information required to design a photonic chip.

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What is a PDK?

A Process Design Kit (PDK) contains component designs and the information required to design a photonic chip. Wave Photonics uses proprietary design technology to create expansive, state-of-the-art PDKs for many processes and wavelengths. Our components are designed to account for the imperfections and variations that occur in the fabrication process to maximise the yield and minimise the need for iterative development.

Wave Photonics PDKs come with fabrication-aware Scattering Parameters (S-Params) to allow for full circuit simulation before taping out a chip, and work out of the box with popular photonic chip design software.

To access PDKs for a range of materials and wavelengths:

SiNQ PDK

The Silicon Nitride for Quantum (SiNQ) PDK is the world’s most expansive photonics PDK and is designed for users requiring Photonics Integrated Circuits (PICs) for quantum applications. The PDK spans 33 Wavelengths from 493 nm to 1550 nm to enable integrated photonics for trapped ions, atoms, NV centres, quantum dots, and a huge range of other systems and emitters. The SiNQ process is available from CORNERSTONE.

The SiNQ PDK specification can be found here.

Works out of the box with:

  • GDSFactory

    Open-source, python-based layout

  • L-Edit Photonics

    Drag and drop layout functionality

  • Coming soon: IPKISS

    Python-based photonics IC design

Custom PDKs

For many applications with exacting requirements, such as high-bandwidth communication for AI and datacentres, gas sensing, and satellite communication, there is a lack of readily available fabrication processes or PDKs - it can be necessary to use dedicated wafer runs on materials like thin-film lithium niobate, aluminium oxide, gallium arsenide, and a range of other materials.

For new processes, Wave Photonics’ platform enables the generation of a PDK within weeks of having the required process data. To learn more about PDKs on new processes:

Access our designs

1

Design your chip using our black box designs.

Design

2

We will arrange payment and set a date for the swap-out.

Contact us

3

We swap out the black boxes and send the design to your chosen fab.

Access designs

4

Your chips get made using the real component designs.

Tapeout